7 results
Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F08-06
- Print publication:
- 2010
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Aluminum Thermo Compression Bonding Characterization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1222 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1222-DD04-02
- Print publication:
- 2009
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Metal Wafer Bonding for MEMS Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1139 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1139-GG03-33
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- 2008
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Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1139 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1139-GG03-35
- Print publication:
- 2008
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Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1052 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 1052-DD03-15
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- 2007
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Low Temperature MEMS Manufacturing Processes: Plasma Activated Wafer Bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 872 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, J7.1
- Print publication:
- 2005
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Si/GaAs heterostructures fabricated by direct wafer bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 681 / 2001
- Published online by Cambridge University Press:
- 21 March 2011, I5.3
- Print publication:
- 2001
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